Winfield said:
John Devereux wrote...
Slide 28, which says that Tin Whiskers are a big problem that
needs addressing?
Or the next few slides detailing severe problems occurring with
a small amount of lead contamination in lead-free soldering?
Or pointing out the 30 degree-C higher soldering temperatures?
Or is that page 28 (slide 35), back to the Tin Whiskers problem?
Yes, thanks for that, very reassuring...
From
http://uk.farnell.com/images/en/ede/pdf/PKG153.pdf
Lead-free alloy soldering temperature is higher (30°C -
40°C), which can lead to a variety of defects such as:
Thermal fatigue of solder joints - not well understood,
research is on-going
^^^^^^^^^^^^^^^
Tin-whiskers from electroplated tin termination
coatings - not fully understood, research is on-going
^^^^^^^^^^^^^^^
Delamination of multi-layer PCBs
Damage to plated through holes - especially with
narrow holes in thicker laminate
PCB warping - can damage components, cause open
circuits, misalignment
IC packages are more susceptible to “pop-corn”
failure. The IPC/JEDEC-020B Moisture Sensitivity
Level for components with lead-free soldering can be
1 or 2 levels lower.
Damage to heat sensitive components
Check upper temperature limit in
manufacturers datasheet
Wetting
of most lead-free solders is inferior to tin/lead.
Just to *really* make your day.
Nice of them to research stuff after making it law !
Graham