Maker Pro
Maker Pro



Jae Purvis

Jan 1, 1970
Please posts your questions and answers from anything from MOS device
theory, processing, and design. I'd like to see what comes of it. I'm
not exactly an expert in VLSI but I'm always looking to know more.

Someone asked me a simple question the other day concerning the
limitation of increasing the power supply to reduce delays. My
explanation is that once you increase the supply voltage at the drain
terminal, the depletion region should extend to the source. This
means there should be no carriers at the surface for conduction in
the channel area. Thus carriers are swept across the channel to the
source independently of gate voltage(i.e. when vgs=0) at the
saturation velocity. Someone verify if this is the limitation. This
condition should be avoided however......

at submicron level, such small geometries invite punchthrough and hot
carrier problems. Can someone explain how to avoid these problems say
for 5V supply? I know that by grading the doping concentration away
from the oxide is one way of getting rid of hot carrier problems.
Another possible solution could be reduce the internal circuit
voltages so that these problmes do not arise. Any input would be