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Help: Upgrade Laptop soldered RAM

Unlaced8126

Feb 25, 2023
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Feb 25, 2023
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I want to attempt upgrading the soldered RAM on my HP 13-ay0095AU from 8GB to 16GB. While I have the tools and experience soldering, I am having some trouble understanding the documentation (schematics .PDF and .cad file attached).

As far as I can tell, they should be the correct and the same board. RAM-related info seems to be mainly on page 12 of the PDF. I've also attached a photo of the physical board, found online.

I have a few questions:
1. The board seems to physically have 8 spots for RAM chips. However, Googling the part numbers for the 8 GB setups (e.g. H5AN8G6NCJR-XNC) suggests that those are 16x 512 MB chips? Am I reading this wrongly?
2. If I find an online vendor with the part "K4AAG165WA-BCWE", do I just order 1 unit? Or 8 units, 1 for each spot?
3. How do the "RAM_ID1...4" work? Are they just bridged pads or resistors or something else?

Any help/tips/advice would be greatly appreciated!
 

Attachments

  • Compal GPR31 LA-J481P Rev 1.0 Схема.pdf
    4.3 MB · Views: 2
  • Compal LA-J481P GPR31 r1.0 boardview (cad).rar
    204.1 KB · Views: 1
  • ezgif-4-7fcc1099a0.jpg
    ezgif-4-7fcc1099a0.jpg
    279.2 KB · Views: 2

73's de Edd

Aug 21, 2015
3,628
Joined
Aug 21, 2015
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3,628
Scroll on down to the appropriate MBO.


I have the tools and experience *** soldering

***
8 packages, all in butt to butt CLOSE PROXIMITY spacing and their combined 96 X 8 = 768 hidden solder ball joints . . . . . . . to assure their having positively no error of connectivity, in a hot air pull and rework situation.
 
Last edited:

Unlaced8126

Feb 25, 2023
3
Joined
Feb 25, 2023
Messages
3
Scroll on down to the appropriate MBO.


I know the RAM is soldered, hence why I'm here in the first place. Haven't Apple devices been upgraded like this as well? But due to their popularity it's easier to find specific directions/deciphered schematics.

8 packages, all in butt to butt CLOSE PROXIMITY spacing and their combined 96 X 8 = 768 hidden solder ball joints . . . . . . . to assure their having positively no error of connectivity, in a hot air pull and rework situation.
I'm not sure how proximity is relevant with a heated bed and hot air? It's not like I'm sticking an iron tip in between the components.
 

Unlaced8126

Feb 25, 2023
3
Joined
Feb 25, 2023
Messages
3
Got it figured out with help from this page. The RAM_ID are just locations for 10k 0201 5% resistors. No additional resistors need to be purchased because they're all there, just need to switch positions to toggle the high/low states.

RAM_ID locations.png
 
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