- Jan 1, 1970
Well as you know, only the electrical test limits (in theory) can be
trusted. The curves are guidelines. The story I was always told about
electrical limits is the customer gets the right to return a part for a
replacement if the part fails electricals. Since nobody does incoming
inspection these days, that means a lot of crap gets shipped if the
vendor has poor quality. [Note the manufacturers flow usually has a QA
test for each lot on a sample basis to insure the test hardware wasn't
fubar. QA test is probably over temperature. ]
Actual testing for commercial parts is limited to basic function, often on
wafer. Industrial parts get tested at 25 C and maybe at high temp,
usually after packaging, no real process difference except test failures
are usually dropped back into commercial bins. Military grades require
much more bookkeeping. Generally only "selected wafers" get a chance to
be Military grade.
The goop would have to be much less expensive that package plastic orAnyway, I see your point and the datasheet doesn't make sense. I can't
think of anything in a ceramic package that would cause it to leak more
than plastic. I assume they don't put carbon black in this plastic
package, but that could make it worse than ceramic.
Some manufacturers put goop over the chip prior to the plastic going
around the leadframe. I assume that goop has high resistivity.
preserve exotic properties like ultra low leakage.