Danneskjold
- Apr 16, 2010
- 23
- Joined
- Apr 16, 2010
- Messages
- 23
Hello Everyone,
Just registered and happy to find this place!
I am working with a friend on an electronics project that we intend to produce ourselves while the numbers are small. Then of course we'll farm it out to a stuffing house.
Our new board consist of both through-hole and surface-mount parts, including a FPGA. We are not quite sure about how to go about soldering everything efficiently.
and obviously we don't want to buy a wave solder, especially here in California!
I have read some of the posts about using solder paste for through-hole. Unreliable, is what I took away from it.
So, how would you go about doing this soldering job? Right now we are looking at hot air rework for the smd parts and with a special nozzle for the FPGA. Then, manually soldering the throug-hole parts. I hate to think of that kind of labor, form a number of perspectives!
Are we sure that the shole thing could not be assembled with generous dollops of solder paste on the through hole parts, and run it through a convection oven for reflowing?
Or, has anyone tried to do some kind of DIY pseudo wave soldering, wherein the board is heated and sprayed with flux, and dipped into a bath of molten solder for a very short time? I have read about folks trying this in other parts of the Intrnet, and no one can really offer anything that works.
I was thinking of some kind of enclosure that is devoid of oxygen (by N2 purge or the like) to avoid the dross problems.
OK that's a lot for my first post. Looking forward to your responses!
Cheers,
Danneskjold
Just registered and happy to find this place!
I am working with a friend on an electronics project that we intend to produce ourselves while the numbers are small. Then of course we'll farm it out to a stuffing house.
Our new board consist of both through-hole and surface-mount parts, including a FPGA. We are not quite sure about how to go about soldering everything efficiently.
and obviously we don't want to buy a wave solder, especially here in California!
I have read some of the posts about using solder paste for through-hole. Unreliable, is what I took away from it.
So, how would you go about doing this soldering job? Right now we are looking at hot air rework for the smd parts and with a special nozzle for the FPGA. Then, manually soldering the throug-hole parts. I hate to think of that kind of labor, form a number of perspectives!
Are we sure that the shole thing could not be assembled with generous dollops of solder paste on the through hole parts, and run it through a convection oven for reflowing?
Or, has anyone tried to do some kind of DIY pseudo wave soldering, wherein the board is heated and sprayed with flux, and dipped into a bath of molten solder for a very short time? I have read about folks trying this in other parts of the Intrnet, and no one can really offer anything that works.
I was thinking of some kind of enclosure that is devoid of oxygen (by N2 purge or the like) to avoid the dross problems.
OK that's a lot for my first post. Looking forward to your responses!
Cheers,
Danneskjold