M
markp
- Jan 1, 1970
- 0
Hi All,
I have a component on a PCB that is simply a set of pads with no component
fitted. The idea is that the processor will be fitted pre-programmed, but if
I ever want to change the firmware any existing boards can be re-programmed
using a test pin header using spring type contacts. This keeps the cost down
of the main board by not requiring a header while still gives the ability to
easily re-program.
Question: In the CAD I have padstacks that define the solder paste. I
obviously don't want solder paste on these pads, so is it my responsibility
to remove the solder paste layer for this component and give the assembly
house the final stencil gerbers, or does the assembly house modify them to
produce their own stensils? If the latter I presume they would also not
paste un-fitted components. What is the normal way things are done?
Mark.
I have a component on a PCB that is simply a set of pads with no component
fitted. The idea is that the processor will be fitted pre-programmed, but if
I ever want to change the firmware any existing boards can be re-programmed
using a test pin header using spring type contacts. This keeps the cost down
of the main board by not requiring a header while still gives the ability to
easily re-program.
Question: In the CAD I have padstacks that define the solder paste. I
obviously don't want solder paste on these pads, so is it my responsibility
to remove the solder paste layer for this component and give the assembly
house the final stencil gerbers, or does the assembly house modify them to
produce their own stensils? If the latter I presume they would also not
paste un-fitted components. What is the normal way things are done?
Mark.