Maker Pro
Maker Pro

Supper Cooling Radion GPU in HP Pavilion tx2350ea Laptop - How to ?

Hi all,

I have this Laptop which has given up the ghost immediately two days
after its warranty expiring. To cut the long story short, I have
ordered another mobo. The original heat sink method for GPU on this
mobo is thermal pad which I think is very inefficient, causing lots of
laptop failure and HP has, I believe withdrawn this laptop from the
market.

There is a gap of about 1mm between the GPU and heat sink, and the
surface of the heat sink is not flat for the obvious reason that it is
meant for thermal pad.

What alternative I have for cooling the GPU more effeciently ? Is it
possible to fill the gap with some thermal compound which would not
run or blead. Or reduce the gap with a copper shim and use thermal
paste on either side. Resurfacing the original heat sink surface is
not an option.

Appreciate your thoughts on it.
 
M

Meat Plow

Jan 1, 1970
0
Hi all,

I have this Laptop which has given up the ghost immediately two days
after its warranty expiring. To cut the long story short, I have ordered
another mobo. The original heat sink method for GPU on this mobo is
thermal pad which I think is very inefficient, causing lots of laptop
failure and HP has, I believe withdrawn this laptop from the market.

There is a gap of about 1mm between the GPU and heat sink, and the
surface of the heat sink is not flat for the obvious reason that it is
meant for thermal pad.

What alternative I have for cooling the GPU more effeciently ? Is it
possible to fill the gap with some thermal compound which would not run
or blead. Or reduce the gap with a copper shim and use thermal paste on
either side. Resurfacing the original heat sink surface is not an
option.

Appreciate your thoughts on it.

Direct contact with an even thin film of past is always the best.
Whatever you can do to approximate that would be the best solution.
I find it hard to believe there was a 1mm gap between the sink and the
top of the cpu, that's insanity.
 
G

Gnack Nol

Jan 1, 1970
0
Direct contact with an even thin film of past is always the best.
Whatever you can do to approximate that would be the best solution. I
find it hard to believe there was a 1mm gap between the sink and the top
of the cpu, that's insanity.

Well it's just the tip of the iceburg. This has been industry practice for
at least 5 years now. They use a boron impregnated rubber pad to ease
their quick assembly builds and make careful surfacing of the heatsink
assembly unnecessary also it's street labor friendly for the building.

That is why there are so many ads for the copper shims on ebay and others
to replace the rubber goo.

The iceberg is the BGA mounting system which is totally ridiculous and
unreliable to the point of planned obsolescence run rampant. You simply
can't expect an inflexible ball of tin to manage the stresses of heat
shock and vibration without cracking and becoming unreliable.

The sea floating the iceberg is the elimination of lead from the solder
resulting in brittle easily fractured connections especially in the size
range of the solder balls that they use as pins on the leadless
intergrated circuits.

It's a designed for failure by it's very nature. Along with poor
ventilation (a laptop by nature should be able to rest on your lap
without overheating ) and then the easily clogged barely sufficient
heatsink assemblies. It's no wonder most die shortly after warranty.

Ah planned obsolescence, a wonderful profit generator for the makers and a
fist to the face of the consumers.


Gnack
 
Top